ABRASIVE
PRODUCTS

GLANZOX

GLANZOX is a colloidal silica suspended in liquid with added special ingredients. On semiconductor wafers, GLANZOX produces a near-perfectly smooth surface down to the nanometer level.

In addition, GLANZOX greatly reduces the metal impurities that can be left by the polishing process.

CLEALITE

CLEALITE is a polishing slurry that produces a mirror finish on various kinds of metals such as aluminum, stainless steel and titanium. Depending on the type used, special additives are included to deliver a scratch-free surface with a surface roughness of 10nm (Rmax). CLEALITE can also be used as a final polish for metals.

POLIPLA

POLIPLA is a compound-type polishing slurry developed for plastic lenses. This high-purity alumina is uniformly dispersed in a special solution with a pH of about 3.0 to 4.0, which delivers excellent polishing performance and a high-quality finished surface. POLIPLA is available in a wide range of types allowing you to select the optimal solution for your needs. POLIPLA also can come with various additives to prevent corrosion and foaming for applications subject to metal corrosion.

COMPOL

COMPOL is a colloidal silica slurry developed especially for polishing metals, ceramics and electronic substrates such as lithium niobate, lithium tantalate and sapphire. With excellent particle uniformity and dispersal, it delivers a high removal rate and damage-free polishing.

FZ

FZ consists of ultra-fine zirconium oxide particles and are optimal for polishing special metals such as molybdenum, tungsten, chromium, titanium, nickel and their alloys. When used with a hard urethane pad and polishing pitch, FZ produces a deep, scratch-free luster to metals.

You can also use FZ-02 for final polishing of optical lenses removing all scratches and bumps from the lens surface and eliminating interference in the transmitted light.

INSEC

INSEC series produces a high-precision mirror finish on compound semiconductor materials. The INSEC series also works well as an etching agent for LED-related GaAs and GaP products.

All of the INSEC products come in the form of granules and must be dissolved before use.

PWA - PLATELET CALCINED ALUMINA

PWA is a white calcined alumina abrasive powder consisting of plate-shaped crystals of aluminum oxide (Al₂O₃) with a purity of over 99.0%.

• Chemically inert
• Will not be corroded by acids or alkalines
• Excellent heat-resistant properties
• More uniform grades than most companies

The particle size distribution is tightly controlled and produces a very finely lapped surface allowing for a wide range of applications.

A - REGULAR FUSED ALUMINA

A is the most widely known abrasive powder, popularly known as Arundum. Fujimi produces A by melting bauxite in an electric furnace at a temperature of 2000 °C to obtain Al₂O₃ corundum crystals of at least 90% purity.

In addition, the process fuses crystals with a small percentage of titanium, which increases the toughness (tenacity) of the abrasive particles. As a result, A has the highest degree of toughness of all Fujimi abrasive powders. Fujimi manufactures A for a consistent distribution of particle sizes for a highly efficient, highly stable abrasive.

WA - WHITE FUSED ALUMINA

WA is a fused white alumina abrasive powder produced by crushing fused alumina and sorting the particles into a uniform size. The resulting compound has the following characteristics:

• An α-type corundum crystal configuration
• At least 96% pure Al₂O₃ composition
• Hardness nearly equal to Silicon Carbide
• Closely controlled particle-size distribution
• Consistent particle shape

These characteristics make WA a superb choice for high-level surface polishing.

FO - FUJIMI OPTICAL EMERY

FO is an alumina-based powder designed specifically for precise lapping of semiconductor wafers. The shape and hardness of FO leads to a scratch-free surface. These same qualities make FO a superior lapping agent for lenses, prisms, hardened glass types, and other optical glassware.